(1)     Xu J, Luo JB, Lu XC, Wang LL, Pan GS and Wen SZ, “Atomic scale deformation in the solid surface induced by nanoparticle impacts”, Nanotechnology, 16, 859-864, 2005

(2)     Xu J, Luo JB, Zhang CH, Zhang W, Pan GS, “Nano-deformation of a Ni-P coating surface after nanoparticle impacts,” APPLIED SURFACE SCIENCE 252 (16): 5846-5854, 2006

(3)     Sun Jiazhen, Pan Guoshun, Zhu Yonghua, Dai Yuanjing，Luo Jianbin，Li Weimin. 颗粒等抛光液组分对硬盘盘基片抛光的影响. 润滑与密封, 2007, 32(11): 1-4；

(4)     Zhu Yonghua，Pan Guoshun，Dai Yuanjing，Luo Jianbin，Liu Yan. 抛光液pH值等对硬盘玻璃盘基片化学机械抛光的影响. 润滑与密封, 2007, 32(11): 24-27。

(5)     Sun Jiazhen, Pan Guoshun, Zhou Yan, Zhu Yonghua et al. Effect of ingredients in slurry containing alumina on chemical mechanical polishingof hard disk substrate. CIST 2008, Sept.24-27, 2008, Beijing

(6)     Liu Ping, Lu Xinchun, Liu Yuhong, Luo Jianbin and Pan Guoshun.Chemical mechanical planarization of copper using ethylenediamine and hydrogen peroxide based slurry. CIST 2008, Sept.24-27, 2008, Beijing

(7)     Dai Yuanjing，Pan Guoshun，Pei Huifang，Sun Jiazhen，Liu Yan & Du Huan.Slurry parameters effect on chemical-mechanical planarization (CMP) of deposited silver (Ag) on chips. CIST 2008, Sept.24-27, 2008, Beijing

(8)     Zhang Wei, Lu Xinchun, Liu Yuhong, Pan Guoshun, Luo Jianbin. 氨基乙酸-H2O2 体系抛光液中铜的化学机械抛光研究. 摩擦学学报, 2008, 28(4): 366-371

(7)     Zhang Wei, Lu Xinchun, Liu Yuhong, Pan Guoshun, Luo Jianbin. Effect of pH on Material Removal Rate of Cu in Abrasive Free Polishing. Journal of the Electrochemical Society, 2009, 156(3): 176-180

(9)     Zhang Wei, Lu Xinchun, Liu Yuhong, Pan Guoshun, Luo Jianbin. Inhibitors for organic phosphonic acid system abrasive free polishing of Cu. Applied Surface Science, 2009, 255(7): 4114-4118