1)     Jiazhen Sun，Guoshun Pan，Yan Zhou，Yonghua Zhu，Jianbin Luo，Xin Chun Lu，Yan Liu. Effect of Ingredients in Slurry Containing Alumina on Chemical Mechanical Polishing of Hard Disc Substrate. Journal of Engineering Tribology, 2009，223（7）: 1003-1011.

  2)     Zhang Wei, Lu Xinchun, Liu Yuhong, Pan Guoshun, Luo Jianbin. Effect of pH on Material Removal Rate of Cu in Abrasive Free Polishing. Journal of The Electrochemical Society, 2009, 156 (3): H176-H180.

3)     Zhang Wei, Lu Xinchun, Liu Yuhong, Pan Guoshun, Luo Jianbin. Inhibitors for organic phosphonic acid system abrasive free polishing of Cu. Applied Surface Science, 2009，255: 4114–4118.

 4)     Dai Yuanjing，Pan Guoshun，Pei Huifang，Sun Jiazhen，Liu Yan & Du Huan. Slurry parameters effect on chemical-mechanical planarisation (CMP) of deposited silver (Ag) on chips. Int. J. Surface Science and Engineering，accepted.

  5)       Zhonghua Gu, Guoshun Pan, Tuo Li, Jianbin Luo, Xinchun Lu, Yan Liu. Effect of the stability parameters of nano-SiO₂ slurries on Chemical-mechanical polishing (CMP) of silicon wafer. WTC 2009, Sep 6 – 11, 2009, Kyoto.

 6)        Yan Zhou, Guoshun Pan, Yonghua Zhu, Jianbin Luo, Xinchun Lu, Yan Liu. Material Removal and Surface Modification in Chemical Mechanical Polishing of GaAs Wafer. WTC 2009, Sep 6 – 11, 2009, Kyoto.

 7)        Liu Yuhong, Luo Jianbin, et al. Fabrication and tribological properties of super-hydrophobic surfaces based on porous silicon. Applied Surface Science, 2009, 255(23): 9430-9438  

   8)        Zhang Wei, Lu Xinchun, Liu Yuhong, Luo Jianbin. Synergistic effect of ethylene thiourea and bis-(3-sulfopropyl)-disulfide on acid Cu electrodeposition. Journal of the Electrochemical Society, 2007, 154(10): D526-D529.

  9)        Han, Baolei; Lu, Xinchun. Effect of nano-sized CeF3 on microstructure, mechanical, high temperature friction and corrosion behavior of Ni-W composite coatings. Surface & Ccatings Technology,  2009, 203(23): 3656-3660

 10)     Wenhu Xu, Xinchun Lu . Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate, Applied Surface Science, 256, 3936–3940, 2010

 11)  张伟, 路新春, 刘宇宏, 潘国顺, 雒建斌. 氨基乙酸-H₂O₂体系抛光液中铜的化学机械抛光研究. 摩擦学学报, 2008, 28(4):366-371.

 12)  孙家振，潘国顺，朱永华等. 颗粒等抛光液组分对硬盘盘基片抛光的影响.润滑与密封，2007，32（11）：1-4

  13)  朱永华，潘国顺，戴媛静等. 抛光液pH 值等对硬盘玻璃盘基片化学机械抛光的影响.润滑与密封，2007，32（11）：24-27

 14)        刘源，何永勇， 陈大融. 基于小波熵的空化状态检测与识别.机械强度, 2009年，1：19-23

 15)        何永勇，印欣运，褚福磊. 基于小波尺度谱的转子系统碰摩声发射特性. 机械工程学报, 2007，6：149-153