【Product introduction】

This product contains SiO2 particles as the main abrasive particles and a serial of chemical reagents including the oxidizer, corrosive, complexing agent,corrosion inhibitor and lubricant , etc. It has realized the dynamic equilibrium of chemical and mechanical effect, and provides higher material removeal rate and good surface quality. The related research outcomes have been awarded the first prize ( education ministry Scientific and Technological Progress, 2005 ) and the Second Prize ( State Scientific and Technological Progress, 2008).

【Primary application】

Mainly used in hard dish substrate precise polishing field.

【Main parameters】

This product consists of two original liquids;

Liquid A: particle diameter 10~30nm, specific gravity 1.1~1.25;

Liquid B: PH0.35~0.5, specific gravity1.0~1.2.

【Technical index】

Material removal rate (MRR)＞0.5 μm;

Aerage Waviness (Wa) of polished surface＜ 0.5? , Average Roughness (Ra)＜0.28?;

The polished surface presents no defects including corrosive point、pit、micro-scratch、contamination.

【Using method】

Mixing Liquid A with the mixture of Liquid B and deionized water under string condition in the ratio of 1:1:5 (A/B/ deionized water).

【Packaging】

20kg/barrel

【Storage】

Storage temperature: 10～65℃;

ventilate and avoid direct sunlight;

shelf life :one year.