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This product is suitable the semiconductor materials such as silicon wafer surface first/ second polishing, The most notable feature is the high material removal rate (1μm/min), the nice surface quality and a high pass rate, and very convenient. The surface roughness of polished wafer below 0.2nm, the polished wafers pass rate reach 97% in the famous trial production line, and in full compliance with production and application requirements, can replace similar foreign imported products. 

Appearance
   Milky white or slightly yellow slurry.
Physical Data

   Content (as SiO2% total) ------25% ~ 30%
   pH, -------------------------------10.4 ~ 11.4
   Specific Gravity (20 oC) ------1.10 ~ 1.20
   Size ------------------------------15nm ~ 30nm
   Viscosity (20 oC) ---------------less than 25c.p
Usage

Before use, the silicon wafer polishing slurry is diluted with deionized water to 20-fold.
Packing
soft bag packing, 19 kg / bag.
Shelf Life
12 months.
Storage

1. Stored in dark and ventilate place.
2. Storage Temperature 0 ~ 30oC.

Note

1. Use wear gloves, masks, goggles, and clothes and other protective equipment to avoid skin and eye in direct contact with the slurry.
2. Using the slurry in the ventilation and avoid inhalation of the volatile gases out of the slurry.
3. Such as physical contact with the slurry and immediately take the necessary measures.
First Aid

1. If contact with eyes,
immediately flush eyes( including the eyelids) with plenty of water for at least 15 minutes, Call a physician
if necessary.
2. If contact with the skin,
immediately flush skin with plenty of water
, Call a physicianif necessary.
3. If inhaled volatile gases,
remove to fresh air. If not breathing, give
artificial respiration. If breathing is difficult, give oxygen and call a physician.
4. If swallowed, seek medical care immediately. If possible, gargle and drink water or milk.